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  • TPS7B86-Q1Functional Safety FIT Rate, FMD and Pin FMA

    • SFFS315 September   2022 TPS7B86-Q1

       

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  • TPS7B86-Q1Functional Safety FIT Rate, FMD and Pin FMA
  1.   Trademarks
  2. 1Overview
  3. 2Functional Safety Failure In Time (FIT) Rates
    1. 2.1 TO-252 Package
    2. 2.2 HSOIC Package
  4. 3Failure Mode Distribution (FMD)
  5. 4Pin Failure Mode Analysis (Pin FMA)
    1. 4.1 TO-252 Package
    2. 4.2 HSOIC Package
    3. 4.3 HSOIC Package B Version
    4. 4.4 HSOIC Package D Version
  6. IMPORTANT NOTICE
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FUNCTIONAL SAFETY FIT RATE, FMD AND PIN-FMA

TPS7B86-Q1Functional Safety FIT Rate, FMD and Pin FMA

Trademarks

All trademarks are the property of their respective owners.

1 Overview

This document contains information for the TPS7B86-Q1 (TO-252 and HSOIC packages) to aid in a functional safety system design. Information provided are:

  • Functional safety failure in time (FIT) rates of the semiconductor component estimated by the application of industry reliability standards
  • Component failure modes and their distribution (FMD) based on the primary function of the device
  • Pin failure mode analysis (pin FMA)

Figure 1-1 shows the device functional block diagram for a fixed output without PG for reference.

Figure 1-2 shows the device functional block diagram for an adjustable output without PG for reference

Figure 1-3 shows the device functional block diagram for a fixed output with PG for reference

GUID-16D4A013-B77A-4AEA-8898-073CDAB8E928-low.gif Figure 1-1 TPS7B86-Q1 Fixed Output Without PG
GUID-46B9FB9F-6DEB-4FE6-88D4-9E3923C69D90-low.gif Figure 1-2 TPS7B86-Q1 Adjustable Output Without PG
Figure 1-3 TPS7B86-Q1 With PG

The TPS7B86-Q1 was developed using a quality-managed development process, but was not developed in accordance with the IEC 61508 or ISO 26262 standards.

2 Functional Safety Failure In Time (FIT) Rates

2.1 TO-252 Package

This section provides functional safety failure in time (FIT) rates for the TO-252 package of the TPS7B86-Q1 based on two different industry-wide used reliability standards:

  • Table 2-1 provides FIT rates based on IEC TR 62380 / ISO 26262 part 11
  • Table 2-2 provides FIT rates based on the Siemens Norm SN 29500-2
Table 2-1 Component Failure Rates per IEC TR 62380 / ISO 26262 Part 11
FIT IEC TR 62380 / ISO 26262 FIT (Failures Per 109 Hours)
Total component FIT rate 15
Die FIT rate 4
Package FIT rate 11

The failure rate and mission profile information in Table 2-1 comes from the reliability data handbook IEC TR 62380 / ISO 26262 part 11:

  • Mission profile: Motor control from table 11
  • Power dissipation: 500 mW
  • Climate type: World-wide table 8
  • Package factor (lambda 3): Table 17b
  • Substrate material: FR4
  • EOS FIT rate assumed: 0 FIT
Table 2-2 Component Failure Rates per Siemens Norm SN 29500-2
Table Category Reference FIT Rate Reference Virtual TJ
4 Power amplifier and regulator ≤ 1 Watt – (LDO) 40 FIT 70°C

The reference FIT rate and reference virtual TJ (junction temperature) in Table 2-2 come from the Siemens Norm SN 29500-2 tables 1 through 5. Failure rates under operating conditions are calculated from the reference failure rate and virtual junction temperature using conversion information in SN 29500-2 section 4.

 

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