TPS2HB35-Q1Functional Safety FIT Rate, FMD and Pin FMA
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1 Overview
This document contains information for TPS2HB35-Q1 (HTTSOP package) to aid in a functional safety system design. Information provided are:
- Functional Safety Failure In Time (FIT) rates of the semiconductor component estimated by the application of industry reliability standards
- Component failure modes and their distribution (FMD) based on the primary function of the device
- Pin failure mode analysis (Pin FMA)
Figure 1-1 shows the device functional block diagram for reference.
Figure 1-1 Functional Block
DiagramTPS2HB35-Q1 was developed using a quality-managed development process, but was not developed in accordance with the IEC 61508 or ISO 26262 standards.
2 Functional Safety Failure In Time (FIT) Rates
This section provides Functional Safety Failure In Time (FIT) rates for TPS2HB35-Q1 based on industry-wide used reliability standard:
- Table 2-1 provides FIT rates based on IEC TR 62380 / ISO 26262 part 11
| FIT IEC TR 62380 / ISO 26262 | FIT (Failures Per 109 Hours) |
|---|---|
| Total Component FIT Rate | 22 |
| Die FIT Rate | 12 |
| Package FIT Rate |
10 |
The failure rate and mission profile information in Table 2-1 comes from the Reliability data handbook IEC TR 62380 / ISO 26262 part 11:
- Mission Profile: Motor Control from Table 11
- Power dissipation: 750 mW
- Climate type: World-wide Table 8 IEC TR 62380
- Package factor (lambda 3): Table 17b IEC TR 62380
- Substrate Material: FR4
- EOS FIT rate assumed: 0 FIT