• Menu
  • Product
  • Email
  • PDF
  • Order now
  • TPS1H000-Q1Functional Safety FIT Rate, FMD, and Pin FMA

    • SFFS034A July   2021  – July 2021 TPS1H000-Q1

       

  • CONTENTS
  • SEARCH
  • TPS1H000-Q1Functional Safety FIT Rate, FMD, and Pin FMA
  1.   Trademarks
  2. 1Overview
  3. 2Functional Safety Failure In Time (FIT) Rates
  4. 3Failure Mode Distribution (FMD)
  5. 4Pin Failure Mode Analysis (Pin FMA)
  6. 5Revision History
  7. IMPORTANT NOTICE
search No matches found.
  • Full reading width
    • Full reading width
    • Comfortable reading width
    • Expanded reading width
  • Card for each section
  • Card with all content

 

FUNCTIONAL SAFETY FIT RATE, FMD AND PIN-FMA

TPS1H000-Q1Functional Safety FIT Rate, FMD, and Pin FMA

Trademarks

All trademarks are the property of their respective owners.

1 Overview

This document contains information for TPS1H000-Q1 (HVSSOP package) to aid in a functional safety system design. Information provided are:

  • Functional Safety Failure In Time (FIT) rates of the semiconductor component estimated by the application of industry reliability standards
  • Component failure modes and their distribution (FMD) based on the primary function of the device
  • Pin failure mode analysis (Pin FMA)

Figure 1-1 shows the device functional block diagram for reference.

GUID-AB029DC7-4BD9-4633-8105-38605170AE9F-low.gifFigure 1-1 Functional Block Diagram

TPS1H000-Q1 was developed using a quality-managed development process, but was not developed in accordance with the IEC 61508 or ISO 26262 standards.

2 Functional Safety Failure In Time (FIT) Rates

This section provides Functional Safety Failure In Time (FIT) rates for TPS1H000-Q1 based on two different industry-wide used reliability standards:

  • Table 2-1 provides FIT rates based on IEC TR 62380 / ISO 26262 part 11
  • Table 2-2 provides FIT rates based on the Siemens Norm SN 29500-2
Table 2-1 Component Failure Rates per IEC TR 62380 / ISO 26262 Part 11
FIT IEC TR 62380 / ISO 26262 FIT (Failures Per 109 Hours)
Total Component FIT Rate 10
Die FIT Rate 6
Package FIT Rate 4

The failure rate and mission profile information in Table 2-1 comes from the Reliability data handbook IEC TR 62380 / ISO 26262 part 11:

  • Mission Profile: Motor Control from Table 11
  • Power dissipation: 500 mW
  • Climate type: World-wide Table 8
  • Package factor (lambda 3): Table 17b
  • Substrate Material: FR4
  • EOS FIT rate assumed: 0 FIT
Table 2-2 Component Failure Rates per Siemens Norm SN 29500-2
Table Category Reference FIT Rate Reference Virtual TJ
5 CMOS, BICMOS
Digital, analog / mixed
25 FIT 55°C

The Reference FIT Rate and Reference Virtual TJ (junction temperature) in Table 2-2 come from the Siemens Norm SN 29500-2 tables 1 through 5. Failure rates under operating conditions are calculated from the reference failure rate and virtual junction temperature using conversion information in SN 29500-2 section 4.

3 Failure Mode Distribution (FMD)

The failure mode distribution estimation for TPS1H000-Q1 in Table 3-1 comes from the combination of common failure modes listed in standards such as IEC 61508 and ISO 26262, the ratio of sub-circuit function size and complexity and from best engineering judgment.

The failure modes listed in this section reflect random failure events and do not include failures due to misuse or overstress.

Table 3-1 Die Failure Modes and Distribution
Die Failure ModesFailure Mode Distribution (%)
VOUT stuck open (HiZ)20%
VOUT stuck on (VS) 10%
VOUT functional, not in specification voltage or timing45%
Diagnostics not in specification10%
Protection function fails to trip10%
Pin to Pin short any two pins5%

 

Texas Instruments

© Copyright 1995-2025 Texas Instruments Incorporated. All rights reserved.
Submit documentation feedback | IMPORTANT NOTICE | Trademarks | Privacy policy | Cookie policy | Terms of use | Terms of sale