SLASFB9
June 2025
MSPM0H3216
ADVANCE INFORMATION
1
1
Features
2
Applications
3
Description
4
Functional Block Diagram
5
Device Comparison
6
Pin Configuration and Functions
6.1
Pin Diagrams
9
6.2
Signal Descriptions
11
12
13
14
15
16
17
18
19
20
6.3
Connections for Unused Pins
7
Specifications
7.1
Absolute Maximum Ratings
7.2
ESD Ratings
7.3
Recommended Operating Conditions
7.4
Thermal Information
7.5
Supply Current Characteristics
7.5.1
RUN/SLEEP Modes
7.5.2
STOP/STANDBY Modes
7.6
Power Supply Sequencing
7.6.1
POR and BOR
7.6.2
Power Supply Ramp
7.7
Flash Memory Characteristics
7.8
Timing Characteristics
7.9
Clock Specifications
7.9.1
System Oscillator (SYSOSC)
7.9.2
Low Frequency Oscillator (LFOSC)
7.9.3
High Frequency Crystal/Clock
7.9.4
Low Frequency Crystal/Clock
7.10
Digital IO
7.10.1
Electrical Characteristics
7.10.2
Switching Characteristics
7.11
ADC
7.11.1
Electrical Characteristics
7.11.2
Switching Characteristics
7.11.3
Linearity Parameters
7.11.4
Typical Connection Diagram
7.12
Temperature Sensor
7.13
VREF
7.13.1
Voltage Characteristics
7.13.2
Electrical Characteristics
7.14
I2C
7.14.1
I2C Characteristics
7.14.2
I2C Filter
7.14.3
I2C Timing Diagram
7.15
SPI
7.15.1
SPI
7.15.2
SPI Timing Diagram
7.16
UART
7.17
TIMx
7.18
Windowed Watchdog Characteristics
7.19
Emulation and Debug
7.19.1
SWD Timing
8
Detailed Description
8.1
Overview
8.2
CPU
8.3
Operating Modes
8.3.1
Functionality by Operating Mode (MSPM0H321x)
8.4
Power Management Unit (PMU)
8.5
Clock Module (CKM)
8.6
DMA_B
8.7
Events
8.8
Memory
8.8.1
Memory Organization
8.8.2
Peripheral File Map
8.8.3
Peripheral Interrupt Vector
8.9
Flash Memory
8.10
SRAM
8.11
GPIO
8.12
IOMUX
8.13
ADC
8.14
Temperature Sensor
8.15
VREF
8.16
CRC
8.17
UART
8.18
SPI
8.19
I2C
8.20
Low-Frequency Sub System (LFSS)
8.21
RTC_B
8.22
IWDT_B
8.23
WWDT
8.24
Timers (TIMx)
8.25
Device Analog Connections
8.26
Input/Output Diagrams
8.27
Serial Wire Debug Interface
8.28
Device Factory Constants
8.29
Identification
9
Applications, Implementation, and Layout
9.1
Typical Application
9.1.1
Schematic
10
Device and Documentation Support
10.1
Device Nomenclature
10.2
Tools and Software
10.3
Documentation Support
10.4
Support Resources
10.5
Trademarks
10.6
Electrostatic Discharge Caution
10.7
Glossary
11
Revision History
12
Mechanical, Packaging, and Orderable Information
パッケージ・オプション
デバイスごとのパッケージ図は、PDF版データシートをご参照ください。
メカニカル・データ(パッケージ|ピン)
PT|48
サーマルパッド・メカニカル・データ
発注情報
slasfb9_oa
Data Sheet
MSPM0H321x
Mixed-Signal Microcontrollers