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  • LMX2581 Wideband Frequency Synthesizer with Integrated VCO

    • SNAS601G August   2012  – September 2014 LMX2581

      PRODUCTION DATA.  

  • CONTENTS
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  • LMX2581 Wideband Frequency Synthesizer with Integrated VCO
  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Simplified Schematic
  5. 5 Revision History
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Handling Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements, MICROWIRE Timing
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Typical Performance Characteristics
        1. 8.3.1.1 Phase Noise Typical Performance Plot Explanations
        2. 8.3.1.2 Other Typical Performance Plot Characteristics Explanations
      2. 8.3.2  Impact of Temperature on VCO Phase Noise
      3. 8.3.3  OSCin INPUT and OSCin Doubler
      4. 8.3.4  R Divider
      5. 8.3.5  PLL N Divider And Fractional Circuitry
        1. 8.3.5.1 Programmable Dithering Levels
        2. 8.3.5.2 Programmable Delta Sigma Modulator Order
      6. 8.3.6  PLL Phase Detector and Charge Pump
      7. 8.3.7  External Loop Filter
      8. 8.3.8  Low Noise, Fully Integrated VCO
        1. 8.3.8.1 VCO Digital Calibration
      9. 8.3.9  Programmable VCO Divider
      10. 8.3.10 0-Delay Mode
      11. 8.3.11 Programmable RF Output Buffers
        1. 8.3.11.1 Choosing the Proper Pull-Up Component
        2. 8.3.11.2 Choosing the Best Setting for the RFoutA_PWR and RFoutB_PWR Words
      12. 8.3.12 Fastlock
      13. 8.3.13 Lock Detect
        1. 8.3.13.1 Vtune Lock Detect
        2. 8.3.13.2 Digital Lock Detect (DLD)
      14. 8.3.14 Part ID and Register Readback
        1. 8.3.14.1 Uses of Readback
        2. 8.3.14.2 Serial Timing for Readback
      15. 8.3.15 Optimization of Spurs
        1. 8.3.15.1 Phase Detector Spur
        2. 8.3.15.2 Fractional Spur - Integer Boundary Spur
        3. 8.3.15.3 Fractional Spur - Primary Fractional Spurs
        4. 8.3.15.4 Fractional Spur - Sub-Fractional Spurs
        5. 8.3.15.5 Summary of Spurs and Mitigation Techniques
    4. 8.4 Device Functional Modes
      1. 8.4.1 Full Synthesizer Mode
      2. 8.4.2 External VCO Mode
      3. 8.4.3 Powerdown Modes
    5. 8.5 Programming
      1. 8.5.1 Serial Data Input Timing
      2. 8.5.2 Recommended Initial Power on Programming Sequence
      3. 8.5.3 Recommended Sequence for Changing Frequencies
      4. 8.5.4 Triggering Registers
    6. 8.6 Register Maps
      1. 8.6.1 Programming Word Descriptions
        1. 8.6.1.1  Register R15
          1. 8.6.1.1.1 VCO_CAP_MAN — Manual VCO Band Select
          2. 8.6.1.1.2 VCO_CAPCODE[7:0] — Capacitor Value for VCO Band Selection
        2. 8.6.1.2  Register R13
          1. 8.6.1.2.1 DLD_ERR_CNT[3:0] - Digital Lock Detect Error Count
          2. 8.6.1.2.2 DLD_PASS_CNT[9:0] - Digital Lock Detect Success Count
          3. 8.6.1.2.3 DLD_TOL[2:0] — Digital Lock Detect
        3. 8.6.1.3  Registers R10, R9, and R8
        4. 8.6.1.4  Register R7
          1. 8.6.1.4.1 FL_PINMODE[2:0], MUXOUT_PINMODE[2:0], and LD_PINMODE[2:0] — Output Format for Status Pins
          2. 8.6.1.4.2 FL_INV, MUX_INV, LD_INV - Inversion for Status Pins
          3. 8.6.1.4.3 FL_SELECT[4:0], MUXOUT_SELECT[4:0], LD_SELECT[4:0] — State for Status Pins
        5. 8.6.1.5  Register R6
          1. 8.6.1.5.1 RD_DIAGNOSTICS[19:0] — Readback Diagnostics
          2. 8.6.1.5.2 RDADDR[3:0] — Readback Address
          3. 8.6.1.5.3 uWIRE_LOCK - Microwire lock
        6. 8.6.1.6  Register R5
          1. 8.6.1.6.1  OUT_LDEN — Mute Outputs Based on Lock Detect
          2. 8.6.1.6.2  OSC_FREQ[2:0] — OSCin Frequency for VCO Calibration
          3. 8.6.1.6.3  BUFEN_DIS - Disable for the BUFEN Pin
          4. 8.6.1.6.4  VCO_SEL_MODE — Method of Selecting Internal VCO Core
          5. 8.6.1.6.5  OUTB_MUX — Mux for RFoutB
          6. 8.6.1.6.6  OUTA_MUX — Mux for RFoutA
          7. 8.6.1.6.7  0_DLY - Zero Delay Mode
          8. 8.6.1.6.8  MODE[1:0] — Operating Mode
          9. 8.6.1.6.9  PWDN_MODE - Powerdown Mode
          10. 8.6.1.6.10 RESET - Register Reset
        7. 8.6.1.7  Register R4
          1. 8.6.1.7.1 PFD_DLY[2:0] — Phase Detector Delay
          2. 8.6.1.7.2 FL_FRCE — Force Fastlock Conditions
          3. 8.6.1.7.3 FL_TOC[11:0] — Fastlock Timeout Counter
          4. 8.6.1.7.4 FL_CPG[4:0] — Fastlock Charge Pump Gain
          5. 8.6.1.7.5 CPG_BLEED[5:0]
        8. 8.6.1.8  Register R3
          1. 8.6.1.8.1 VCO_DIV[4:0] — VCO Divider Value
          2. 8.6.1.8.2 OUTB_PWR[5:0] — RFoutB Output Power
          3. 8.6.1.8.3 OUTA_PWR[5:0] — RFoutA Output Power
          4. 8.6.1.8.4 OUTB_PD — RFoutB Powerdown
          5. 8.6.1.8.5 OUTA_PD — RFoutA Powerdown
        9. 8.6.1.9  Register R2
          1. 8.6.1.9.1 OSC_2X — OSCin Doubler
          2. 8.6.1.9.2 CPP - Charge Pump Polarity
          3. 8.6.1.9.3 PLL_DEN[21:0] — PLL Fractional Denominator
        10. 8.6.1.10 Register R1
          1. 8.6.1.10.1 CPG[4:0] — PLL Charge Pump Gain
          2. 8.6.1.10.2 VCO_SEL[1:0] - VCO Selection
          3. 8.6.1.10.3 FRAC_ORDER[2:0] — PLL Delta Sigma Modulator Order
          4. 8.6.1.10.4 PLL_R[7:0] — PLL R divider
        11. 8.6.1.11 Register R0
          1. 8.6.1.11.1 ID - Part ID Readback
          2. 8.6.1.11.2 FRAC_DITHER[1:0] — PLL Fractional Dithering
          3. 8.6.1.11.3 NO_FCAL — Disable Frequency Calibration
          4. 8.6.1.11.4 PLL_N - PLL Feedback Divider Value
          5. 8.6.1.11.5 PLL_NUM[21:12] and PLL_NUM[11:0] — PLL Fractional Numerator
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Clocking Application
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Fractional PLL Application
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curves
    3. 9.3 Do's and Don'ts
  10. 10Power Supply Recommendations
    1. 10.1 Supply Recommendations
    2. 10.2 Regulator Output Pins
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information
  14. IMPORTANT NOTICE
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DATA SHEET

LMX2581 Wideband Frequency Synthesizer with Integrated VCO

1 Features

  • Output Frequency from 50 to 3760 MHz
  • Input Clock Frequency up to 900 MHz
  • Phase Detector Frequency up to 200 MHz
  • Supports Fractional and Integer Modes
  • –229 dBc/Hz Normalized PLL Phase Noise
  • –120.8 dBc/Hz Normalized PLL 1/f Noise
  • –137 dBc/Hz VCO Phase Noise @ 1 MHz offset for a 2.5 GHz Carrier
  • 100 fs RMS Jitter in Integer Mode
  • Programmable Fractional Modulator Order
  • Programmable Fractional Denominator
  • Programmable Output Power up to +12 dBm
  • Programmable 32 Level Charge Pump Current
  • Programmable Option to Use an External VCO
  • Digital Lock Detect
  • 3-Wire Serial Interface and Readback
  • Single Supply Voltage from 3.15 V to 3.45 V
  • Supports Logic Levels down to 1.6 V

2 Applications

  • Wireless Infrastructure (UMTS, LTE, WiMax, Multi-Standard Base Stations)
  • Broadband Wireless
  • Test and Measurement
  • Clock Generation

3 Description

The LMX2581 is a low noise wideband frequency synthesizer that integrates a delta-sigma fractional N PLL, multiple core VCO, programmable output divider, and two differential output buffers. The VCO frequency range is from 1880 to 3760 MHz and can be sent directly to the output buffers or divided down by even values from 2 to 38. Each buffer is capable of output power from -3 to +12 dBm at 2700 MHz. Integrated low noise LDOs are used for superior noise immunity and consistent performance.

This synthesizer is a highly programmable device and it enables the user to optimize its performance. In fractional mode, the denominator and the modulator order are programmable and can be configured with dithering as well. The user also has the ability to directly specify a VCO core or entirely bypass the internal VCO. Finally, many convenient features are included such as power down, Fastlock, auto mute, and lock detection. All registers can be programmed through a simple 3 wire interface and a read back feature is also available.

The LMX2581 operates on a single 3.3 V supply and comes in a 32 pin 5.0 mm × 5.0 mm WQFN package.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
LMX2581 WQFN (32) 5.00 mm × 5.00 mm
  1. For all available packages, see the orderable addendum at the end of the datasheet.

4 Simplified Schematic

sch_front_snas601.gif

5 Revision History

Changes from F Revision (March 2014) to G Revision

  • Added "over operating free-air temperature range (unless otherwise noted)" in Absolute Maximum Ratings and Recommended Operating Conditions.Go
  • Added footnotes to HBM, CDM, and MM in Handling Ratings table.Go
  • Moved explanations of Typical Characteristics plots from plot footnotes to Feature Description section.Go
  • Moved Impact of Temperature on VCO Phase Noise into Feature Description section.Go
  • Added some description of modulator noise floor and Table 4. Go
  • Changed -89 to -83 in Table 11Go
  • Moved "Triggering Registers" to "Register Maps" section.Go
  • Changed order of subsections in Application and Implementation section.Go
  • Changed -- inverted color scheme of Figure 23, Figure 24, and Figure 25 to enhance readabilityGo
  • Added links for Device and Documentation Support . Added links to Application Note AN-1879 (SNAA062) throughout the document.Go

Changes from E Revision (Novmeber 2013) to F Revision

  • Added data sheet structure and organization. Added, updated, or renamed the following sections: Device Information Table, Application and Implementation; Power Supply Recommendations; Layout; Device and Documentation Support; Mechanical, Packaging, and Ordering InformationGo
  • Changed Clarified that typical PLL noise metrics are measured at max charge pump gain. Go
  • Added Typical Characteristics curves. Go
  • Changed Recommendation for OSC_FREQ bit for input frequencies > 64 MHz Go
  • Added Application and Implementation section with schematic.Go
  • Added Power Supply RecommendationsGo
  • Added Layout Go

Changes from D Revision (April 2013) to E Revision

  • Changed -- Output Power upgraded from 5 dBm to 7.3 dBm for OUTx_PWR = 15. Go
  • Added output power spec for OUT_PWR = 45. Go
  • Changed Fvco = 1.9 GHz: 10 kHz: –84.8 to –85.4; 100 kHz: –113.7 to –114.5; 1 MHz: –136.7 to –137.Go
  • Changed Fvco = 2.2 GHz: 40 MHz: –155.2 to –156.1. Go
  • Changed Fvco = 2.7 GHz: 100 kHz: –111.1 to –112.2; 1 MHz: –135.5 to –136.0; 10 MHz: –152.9 to –153.1; 40 MHz: –154.6 to –155. Go
  • Changed Fvco = 3.3 GHz: 10 kHz: –77.9 to –79; 100kHz: –108 to –108.6; 1 MHz: –132.4 to –132.6; 10 MHz: –151.5 to –152; 40 MHz: –153.6 to –155. Go
  • Added updates on using 0–Delay ModeGo
  • Added more information on how to use readback. Go
  • Changed SPURS: Fpd spur for Fpd = 100 MHz upgraded from –71 to –81 dBc. Improvement due to better board layout.Go
  • Changed -- Fixed PLL_R[7:0] box drawn incorrectly in the register map.Go
  • Added updates to the applications section on impact of OUTx_PWR.
    Updates to the application section regarding dithering were added.    Go

Changes from C Revision (April 2013) to D Revision

  • Added Typical spur specifications to Electrical Characteristics.Go
  • Changed -- Updates to the programming section were made regarding programming recommendations, clarifications to the register map, and more details for the programming word descriptions. Go
  • Added More information to the applications section regarding fractional spurs Go

Changes from B Revision (October 2013) to C Revision

  • Changed data sheet style from National to TI format.Go

Changes from A Revision (August 2012) to B Revision

  • Added information about resistor and inductor pull-up. Go

6 Pin Configuration and Functions

32-Pin
DAP Package
(Top View)
po_snas601.gif

Pin Functions

PIN TYPE DESCRIPTION
NUMBER NAME
0 DAP GND The DAP should be grounded.
1 CLK Input MICROWIRE Clock Input. High Impedance CMOS input.
2 DATA Input MICROWIRE Data. High Impedance CMOS input.
3 LE Input MICROWIRE Latch Enable. High Impedance CMOS input.
4 CE Input Chip Enable Pin.
5 FLout Output Fastlock Output. This can switch in an external resistor to the loop filter during locking to improve lock time.
6 VccCP Supply Charge Pump Supply.
7 CPout Output Charge Pump Output.
8 GND GND Ground for the Charge Pump.
9 GND GND Ground for the N and R divider.
10 VccPLL Supply Supply for the PLL.
11 Fin Input High frequency input pin for an external VCO. Leave Open or Ground if not used.
12 RFoutA+ Output Differential divided output. For single-ended operation, terminate the complimentary side with a load equivalent to the load at this Pin.
13 RFoutA- Output Differential divided output. For single-ended operation, terminate the complimentary side with a load equivalent to the load at this pin.
14 RFoutB+ Output Differential divided output. For single-ended operation, terminate the complimentary side with a load equivalent to the load at this pin.
15 RFoutB- Output Differential divided output. For single-ended operation, terminate the complimentary side with a load equivalent to the load at this pin.
16 VccBUF Supply Supply for the Output Buffer.
17 VccVCO Supply Supply for the VCO.
18 GND GND Ground Pin for the VCO. This can be attached to the regular ground. Ensure a solid trace connects this pin to the bypass capacitors on pins 19, 23, and 24.
19 VbiasVCO Output Bias circuitry for the VCO. Place a 2.2 µF capacitor to GND (Preferably close to Pin 18).
20 Vtune Input VCO tuning voltage input. See the functional description regarding the minimum capacitance to put at this pin.
21 GND GND VCO ground.
22 VrefVCO Output VCO capacitance. Place a capacitor to GND (Preferably close to Pin 18). This value should be between 5% and 10% of the capacitance at pin 24. Recommended value is 1 µF.
23 VbiasCOMP Output VCO bias voltage temperature compensation circuit. Place a minimum 10 µF capacitor to GND (Preferably close to Pin 18). If it is possible, use more capacitance to slightly improve VCO phase noise.
24 VregVCO Output VCO regulator output. Place a minimum 10 µF capacitor to GND (Preferably close to Pin 18). If it is possible, use more capacitance to slightly improve VCO phase noise.
25 LD Output Multiplexed output that can perform lock detect, PLL N and R counter outputs, Readback, and other diagnostic functions.
26 BUFEN Input Enable pin for the RF output buffer. If not used, this can be overwritten in software.
27 GND GND Digital Ground.
28 VccDIG Supply Digital Supply.
29 OSCin Input Reference input clock.
30 MUXout Output Multiplexed output that can perform lock detect, PLL N and R counter outputs, Readback, and other diagnostic functions..
31 GND GND Ground for the fractional circuitry.
32 VccFRAC Vcc Supply for the fractional circuitry.

7 Specifications

7.1 Absolute Maximum Ratings(1)

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
Vcc Power Supply Voltage -0.3 3.6 V
VIN Input Voltage to Pins other than Vcc Pins -0.3 (Vcc + 0.3) V
TL Lead Temperature (solder 4 sec.) +260 °C
TJ Junction Temperature +150 °C
VOSCin Voltage on OSCin (Pin29) ≤1.8 with Vcc Applied
≤1 with Vcc=0		 Vpp
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7.2 Handling Ratings(1)

MIN MAX UNIT
TSTG Storage Temperature Range -65 150 °C
VESD Electrostatic Discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(2) 2500 V
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(3) 1250
Machine Model (MM)(4) 250
(1) This device should only be assembled in ESD free workstations.
(2) JEDEC document JEP155 states that 2500-V HBM allows safe manufacturing with a standard ESD control process.
(3) JEDEC document JEP157 states that 1250-V CDM allows safe manufacturing with a standard ESD control process.
(4) JEDEC document JEP157 states that 250-V MM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN TYP MAX UNIT
Vcc Power Supply Voltage 3.15 3.3 3.45 V
TJ Junction Temperature 125 °C
TA Ambient Temperature -40 85 °C

7.4 Thermal Information

THERMAL METRIC(1) DAP
32 PINS		 UNIT
RθJA Junction-to-ambient thermal resistance 30 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 4
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

7.5 Electrical Characteristics

(3.15 V ≤ Vcc ≤ 3.45 V, -40°C ≤ TA ≤ 85 °C; except as specified. Typical values are at Vcc = 3.3 V, 25 °C.)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
CURRENT CONSUMPTION
ICC Entire Chip Supply Current One Output Enabled

OUTx_PWR = 15		 178 mA
ICCCore Supply Current Except for Output Buffers Output Buffers and VCO Divider Disabled. 134 mA
ICCRFout Additive Current for EachOutput Buffer OUTx_PWR = 15 44 mA
ICCVCO_DIV Additive VCO Divider Current VCO Divider Enabled 20 mA
ICCPD Power Down Current Device Powered Down
(CE Pin = LOW)		 7 mA
OSCin REFERENCE INPUT
fOSCin OSCin Frequency Range Doubler Enabled 5 250 MHz
Doubler Disabled 5 900
vOSCin OSCin Input Voltage AC Coupled 0.4 1.7 Vpp
SpurFoscin Oscin Spur Foscin = 100 MHz, Offset = 100 MHz -81 dBc
PLL
fPD Phase Detector Frequency 200 MHz
KPD Charge Pump Gain Gain = 1X 110 µA
Gain = 2X 220
... ...
Gain = 31X 3410
PNPLL_1/f_Norm Normalized PLL 1/f Noise
(1)		 Gain =31X
Normalized to 1 GHz carrier and 10 kHz Offset		 –120.8 dBc /Hz
PNPLL_FOM PLL Figure of Merit
(Normalized Noise Floor)
(1)		 Gain =31X.
Normalized to PLL1 and fPD=1Hz		 –229 dBc /Hz
fRFin External VCO Input Pin Frequency Internal VCOs Bypassed
(OUTA_PD=OUTB_PD=1)		 0.5 2.2 GHz
pRFin External VCO Input Pin Power Internal VCOs Bypassed
(OUTA_PD=OUTB_PD=1)		 0 +8 dBm
SpurFpd Phase Detector Spurs
(2)		 Fpd = 25 MHz –85 dBc
Fpd = 100 MHz –81
OUTPUTS
pRFoutA+/-
pRFoutB+/-		 Output Power Level(5)(5) Inductor Pull-Up
Fout=2.7 GHz		 OUTx_PWR=15 7.3 dBm
OUTx_PWR=45 12
H2RFoutX+/- Second Harmonic
(6)		 Fout = 2.7 GHz OUTx_PWR=15 –25 dBc
VCO
fVCO Before the VCO Divider All VCO Cores Combined 1880 3760
KVCO VCO Gain Vtune = 1.3 Volts
 Core 1 12 to 24 MHz/V
Core 2 15 to 30
Core 3 20 to 37
Core 4 21 to 37
ΔTCL Allowable Temperature Drift
(3)		 VCO not being recalibrated Fvco ≥2.5 GHz –125 +125 °C
Fvco < 2.5 GHz –100 +125
tVCOCal VCO Calibration Time
(4)		 fOSCin = 100 MHz
fPD = 100 MHz
Full Band Change 1880 — 3760 MHz		 No Pre-programming 140 us
With Pre-programming 10
PNVCO VCO Phase Noise
(OUTx_PWR =15)		 fVCO = 1.9 GHz

Core 1 		10 kHz Offset –85.4 dBc /Hz
100 kHz Offset –114.5
1 MHz Offset –137.0
10 MHz Offset –154.2
40 MHz Offset –156.7
fVCO = 2.2 GHz

Core 2		 10 kHz Offset –84.6 dBc /Hz
100 kHz Offset –114.1
1 MHz Offset –137.5
10 MHz Offset –154.5
40 MHz Offset –156.1
fVCO = 2.7 GHz

Core 3		 10 kHz Offset –81.7 dBc /Hz
100 kHz Offset –112.2
1 MHz Offset –136.0
10 MHz Offset –153.1
40 MHz Offset –155.0
fVCO = 3.3 GHz

Core 4		 10 kHz Offset –79.0 dBc /Hz
100 kHz Offset –108.6
1 MHz Offset –132.6
10 MHz Offset –152.0
40 MHz Offset –155.0
DIGITAL INTERFACE (DATA, CLK, LE, CE, MUXout, BUFEN, LD)
VIH High-Level Input Voltage 1.4 Vcc V
VIL Low Level Input Voltage 0.4 V
IIH High-Level Input Current VIH = 1.75 V –5 5 µA
IIL Low-Level Input Current VIL = 0 V –5 5 µA
VOH High-Level Output Voltage IOH = -500 µA 2 V
VOL Low-Level Output Voltage IOL = -500 µA 0 0.4 V
(1) The PLL noise contribution is measured using a clean reference and a wide loop bandwidth and is composed into 1/f and flat components. PLL_Flat = PLL_FOM + 20*log(Fvco/Fpd)+10*log(Fpd / 1Hz). PLL_1/f = PLL_1/f_Norm + 20*log(Fvco / 1GHz) - 10*log(Offset/10kHz). Once these two components are found, the total PLL noise can be calculated as PLL_Noise = 10*log( 10PLL_Flat/10) + 10PLL_1/f / 10 )
(2) The spurs at the offset of the phase detector frequency are dependent on many factors, such as he phase detector frequency.
(3) Continuous tuning range over temperature refers to programming the device at an initial temperature and allowing this temperature to drift WITHOUT reprogramming the device. This change could be up or down in temperature and the specification does not apply to temperatures that go outside the recommended operating temperatures of the device.
(4) VCO digital calibration time is the amount of time it takes for the VCO to find the correct frequency band when switching to a new frequency. After the correct frequency band is found , the remaining error is typically less than 1 MHz and then the PLL settles the rest of the error in an analog manner. Pre-programming refers to specifying a band that is close to the final (<20 MHz), which greatly improves the VCO calibration time.
(5) The output power is dependent of the setup and is also programmable. Consult the Applications section for more information.
(6) The harmonics vary as a function of frequency, output termination, board layout, and output power setting.

7.6 Timing Requirements, MICROWIRE Timing

MIN TYP MAX UNIT
tES Clock to Enable Low Time See Figure 1 35 ns
tCS Data to Clock Set Up Time See Figure 1 10 ns
tCH Data to Clock Hold Time See Figure 1 10 ns
tCWH Clock Pulse Width High See Figure 1 25 ns
tCWL Clock Pulse Width Low See Figure 1 25 ns
tCES Enable to Clock Set Up Time See Figure 1 10 ns
tEWH Enable Pulse Width High See Figure 1 10 ns
td_InputTimingDiagram.gifFigure 1. Serial Data Input Timing

7.7 Typical Characteristics

tc02_PLLNoise.gif
Figure 2. Measurement of PLL Figure of Merit and Normalized 1/f Noise
tc08_NarrowbandNoise.gif
Figure 4. Closed Loop Noise for Narrower Bandwidth Filter
tc01_DividerNoise.gif
Figure 6. VCO Output Divider Noise Floor vs. Frequency
tc03_OutputPower.gif
Figure 8. Single-Ended Output Power vs. Frequency
tc12_FinSensitivity.gif
Figure 10. Sensitivity for External VCO Input (Fin) Pin
tc06_OSCinSensitivity.gif
Figure 12. OSCin Input Sensitivity
tc10_KpdNoiseImpact.gif
Figure 3. KPD Impact on PLL Noise Metrics
tc09_WidebandNoise.gif
Figure 5. Closed Loop Noise for Wider Bandwidth
tc04_VCOCalTime.gif
Figure 7. VCO Digital Calibration Time
tc07_RFoutImpedance.gif
Figure 9. Impedance of RFoutX Pins
tc11_FinImpedance.gif
Figure 11. Impedance of External VCO Input (Fin) Pin
tc05_OSCinImpedance.gif
Figure 13. OSCin Input Impedance

 
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