The BOOSTXL-TECDRV BoosterPack is an evaluation platform designated to highlight the TPS63810 use as a driver for a thermoelectric cooling (TEC) module.

The BOOSTXL-TECDRV interfaces to LaunchPad development platforms using the XL connector format. To use the BOOSTXL-TECDRV BoosterPack GUI a specific LaunchPad (the MSP-EXP432P401R) must be used. The LaunchPad communicates to the TPS63810 through its I²C interface and also acts as a USB-to-PC GUI communication bridge.

The MSP-EXP432P401R LaunchPad is controlled by commands received from the BOOSTXL-TECDRV BoosterPack GUI. The LaunchPad sends data to the GUI for display. If a LaunchPad is not used, the BoosterPack plug-in module format allows an alternate external host to communicate with the TPS63810 using the LaunchPad connectors.

The BOOSTXL-TECDRV incorporates circuitry and components with the following features:

• The TPS63810 high efficiency, high output current buck-boost converter with I²C interface.
• On board precision 2.5-V voltage reference.
• External power supply and temperature sensors can be connected through screw terminal blocks.
• I²C interface for the TPS63810 device configuration and communication.

Figure 1-1shows the BOOSTXL-TECDRV architecture along with the key components and blocks listed in the features.

Figure 1-1 BOOSTXL-TECDRV Block Diagram

The quick start presented in this section is a minimalist view of the startup procedure to get the system up and running. More details regarding the hardware and software setup can be found in Section 7.

Download the LaunchPad firmware from the BOOSTXL-TECDRV tools folder . Download and install Energia IDE from the Energia website. The LaunchPad firmware is written in Energia, and needs to be modified for the particular temperature sensor and the TEC module that are used. Alternatively, the Energia code can be used and modified using the cloud CCS tool.