UCC27284-Q1 Functional Safety FIT Rate, FMD and Pin FMA
1 Functional Safety FIT Rate, FMD and Pin FMA
1.1 Overview
This document contains information for UCC27282-Q1 UCC27284-Q1(SOIC and VSON package) to aid in a functional safety system design. Information provided are:
- Functional Safety Failure In Time (FIT) rates of the semiconductor component estimated by the application of industry reliability standards
- Pin failure mode analysis (Pin FMA)
Figure 1-1 shows the device functional block diagram for reference.
Figure 1-1 UCC27282-Q1
application Block diagram
Figure 1-2 UCC27284-Q1
application Block diagramUCC27282-Q1 UCC27284-Q1 were developed using a quality-managed development process, but was not developed in accordance with the IEC 61508 or ISO 26262 standards.
1.2 Functional Safety Failure In Time (FIT) Rates
1.2.1 SOIC Package
This section provides Functional Safety Failure In Time (FIT) rates for the SOIC package of UCC27282-Q1 UCC27284-Q1 based on two different industry-wide used reliability standards:
- Component Failure Rates per IEC TR 62380 / ISO 26262 Part 11 provides FIT rates based on IEC TR 62380 / ISO 26262 part 11
| FIT IEC TR 62380 / ISO 26262 | FIT (Failures Per 109 Hours) |
|---|---|
| Total Component FIT Rate (Power dissipation:10 mW, 100 mW, 500 mW) | 13,14,28 |
| Die FIT Rate (Power dissipation: 10 mW, 100 mW, 500 mW) | 2,3,14 |
| Package FIT Rate (Power dissipation:10 mW,100mW, 500mW) | 11,11,14 |
The failure rate and mission profile information in Component Failure Rates per IEC TR 62380 / ISO 26262 Part 11 comes from the Reliability data handbook IEC TR 62380 / ISO 26262 part 11:
- Mission Profile: Motor Control from Table 11
- Power dissipation: 10 mW, 100 mW, 500 mW
- Climate type: World-wide Table 8
- Package factor (lambda 3): Table 17b
- Substrate Material: FR4
- EOS FIT rate assumed: 0 FIT
| Table | Category | Reference FIT Rate | Reference Virtual TJ |
|---|---|---|---|
| 5 | CMOS, BICMOS, Digital, analog /mixed |
20 FIT | 55°C |