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  • Bridge Design between CAN and SPI with MSPM0 MCUs

    • SLAAEN5 February   2025 MSPM0G1106 , MSPM0G1107 , MSPM0G1506 , MSPM0G1507 , MSPM0G1518 , MSPM0G1519 , MSPM0G3106 , MSPM0G3106-Q1 , MSPM0G3107 , MSPM0G3107-Q1 , MSPM0G3506 , MSPM0G3506-Q1 , MSPM0G3507 , MSPM0G3507-Q1 , MSPM0G3518 , MSPM0G3518-Q1 , MSPM0G3519 , MSPM0G3519-Q1

       

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  • Bridge Design between CAN and SPI with MSPM0 MCUs
  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Introduction
    1. 1.1 Bridge between CAN and SPI
  5. 2Implementation
    1. 2.1 Principle
    2. 2.2 Structure
  6. 3Software Description
    1. 3.1 Software Functionality
    2. 3.2 Configurable Parameters
    3. 3.3 Structure of Custom Element
    4. 3.4 Structure of FIFO
    5. 3.5 SPI Receive and Transmit (Transparent Transmission)
    6. 3.6 SPI Receive and Transmit (Protocol Transmission)
    7. 3.7 CAN Receive and Transmit
    8. 3.8 Application Integration
  7. 4Hardware
  8. 5Application Aspects
    1. 5.1 Flexible structure
    2. 5.2 Optional Configuration for SPI
    3. 5.3 Optional Configuration for CAN
    4. 5.4 CAN Bus Multinode Communication Example
  9. 6Summary
  10. 7References
  11. IMPORTANT NOTICE
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Application Note

Bridge Design between CAN and SPI with MSPM0 MCUs

Abstract

This application note shows an example of CAN to an SPI bridge. The document describes the structure and behavior of a CAN to SPI bridge. The document also discusses the software implementation, hardware connection, and application usage. Users can configure the bridge by modifying the predefine. Relevant code is also provided to users.

Trademarks

LaunchPad™ is a trademark of Texas Instruments.

All trademarks are the property of their respective owners.
Texas Instruments

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