This document contains information for TPS1HB08-Q1 (HTSSOP package) to aid in a functional safety system design. Information provided are:

• Functional Safety Failure In Time (FIT) rates of the semiconductor component estimated by the application of industry reliability standards
• Component failure modes and their distribution (FMD) based on the primary function of the device
• Pin failure mode analysis (Pin FMA)

Figure 1-1 shows the device functional block diagram for reference.

Figure 1-1 Functional Block Diagram

TPS1HB08-Q1 was developed using a quality-managed development process, but was not developed in accordance with the IEC 61508 or ISO 26262 standards.

This section provides Functional Safety Failure In Time (FIT) rates for TPS1HB08-Q1 based on industry-wide used reliability standard:

• Table 2-1 provides FIT rates based on IEC TR 62380 / ISO 26262 part 11

The failure rate and mission profile information in Table 2-1 comes from the Reliability data handbook IEC TR 62380 / ISO 26262 part 11:

• Mission Profile: Motor Control from Table 11
• Power dissipation: 750 mW
• Climate type: World-wide Table 8 IEC TR 62380
• Package factor (lambda 3): Table 17b IEC TR 62380
• Substrate Material: FR4
• EOS FIT rate assumed: 0 FIT

The failure mode distribution estimation for TPS1HB08-Q1 in Table 3-1 comes from the combination of common failure modes listed in standards such as IEC 61508 and ISO 26262, the ratio of sub-circuit function size and complexity and from best engineering judgment.

The failure modes listed in this section reflect random failure events and do not include failures due to misuse or overstress.