OPA2391DSBGAEVM User's Guide
1 Abstract
This user’s guide describes the operation and use of the OPA2391DSBGAEVM. Throughout this document the terms evaluation board and EVM are synonymous with the OPA2391DSBGAEVM. This document also includes a schematic, printed circuit board (PCB) layout drawing, and a bill of materials (BOM).
1 Description
The OPA2391 evaluation board converts the tiny, dual DSBGA package into an easy-to-use, standard, dual, 300-mil-wide, PDIP operational amplifier footprint. The enable (EN) pin, which is not found on a standard PDIP package, is wired to a separate test point and allows for evaluation of the enable function. The PCB can be used in a standard, dual-amplifier PDIP socket, or as individual connections to each bump on the OPA2391YBJ. A 0.1‑μF bypass capacitor (C1) is populated to minimize any supply-noise coupling that could impact the device. The board dimensions are 550 mil × 600 mil.
2 Schematic, PCB Layout, and Bill of Materials
This section provides the EVM hardware schematics, PCB layout, and bill of materials (BOM).
Figure 2-2 PCB
Layout| Reference Designator | Description | Part Number | Vendor |
|---|---|---|---|
| J1, J2 | Header, 2.54 mm, 4x1, gold, black, TH | TS-104-G-AA | Samtec |
| J3 | Header, 2.54 mm, 1x1, gold, TH | TSW-101-08-G-S | Samtec |
| C1 | 0.1 µF ±10% 50-V ceramic capacitor X7R 0603 (1608 metric) | C0603C104K5RAC3121 | Kemet |
| U1 | Precision, ultra-low IQ, low offset voltage, e-trim™ operational amplifier | OPA2391YBJ | Texas Instruments |