SLPS525A September 2014 – January 2016 CSD17578Q3A
PRODUCTION DATA.
Refer to the PDF data sheet for device specific package drawings
This 30 V, 6.3 mΩ, SON 3.3 mm × 3.3 mm NexFET™ power MOSFET is designed to minimize losses in power conversion applications.
.
.
| TA = 25°C | TYPICAL VALUE | UNIT | ||
|---|---|---|---|---|
| VDS | Drain-to-Source Voltage | 30 | V | |
| Qg | Gate Charge Total (4.5 V) | 7.9 | nC | |
| Qgd | Gate Charge Gate to Drain | 1.7 | nC | |
| RDS(on) | Drain-to-Source On-Resistance | VGS = 4.5 V | 8.2 | mΩ |
| VGS = 10 V | 6.3 | mΩ | ||
| VGS(th) | Threshold Voltage | 1.5 | V | |
| DEVICE | MEDIA | QTY | PACKAGE | SHIP |
|---|---|---|---|---|
| CSD17578Q3A | 13-Inch Reel | 2500 | SON 3.3 x 3.3 mm Plastic Package |
Tape and Reel |
| CSD17578Q3AT | 7-Inch Reel | 250 |
| TA = 25°C | VALUE | UNIT | |
|---|---|---|---|
| VDS | Drain-to-Source Voltage | 30 | V |
| VGS | Gate-to-Source Voltage | ±20 | V |
| ID | Continuous Drain Current (Package limited) | 20 | A |
| Continuous Drain Current (Silicon limited), TC = 25°C | 54 | ||
| Continuous Drain Current(1) | 14 | ||
| IDM | Pulsed Drain Current(2) | 142 | A |
| PD | Power Dissipation(1) | 2.5 | W |
| Power Dissipation, TC = 25°C | 37 | ||
| TJ, Tstg |
Operating Junction Temperature, Storage Temperature |
–55 to 150 | °C |
| EAS | Avalanche Energy, single pulse ID = 22 A, L = 0.1 mH, RG = 25 Ω |
24 | mJ |
RDS(on) vs VGS |
Gate Charge |