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  • DRV8833 双路 H 桥电机驱动器

    • ZHCS016E January   2011  – July 2015 DRV8833

      PRODUCTION DATA.  

  • CONTENTS
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  • DRV8833 双路 H 桥电机驱动器
  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Fixed-Frequency PWM Motor Drivers
      2. 7.3.2 Bridge Control and Decay Modes
      3. 7.3.3 Current Control
      4. 7.3.4 nSLEEP Operation
      5. 7.3.5 Protection Circuits
        1. 7.3.5.1 Overcurrent Protection (OCP)
        2. 7.3.5.2 Thermal Shutdown (TSD)
        3. 7.3.5.3 Undervoltage Lockout (UVLO)
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Motor Voltage
        2. 8.2.2.2 Motor Current Trip Point
        3. 8.2.2.3 Sense Resistor
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
    1. 9.1 Bulk Capacitance
    2. 9.2 Power Supply and Logic Sequencing
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Heatsinking
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
      1. 10.3.1 Maximum Output Current
      2. 10.3.2 Thermal Protection
    4. 10.4 Power Dissipation
  11. 11器件和文档支持
    1. 11.1 文档支持
      1. 11.1.1 相关文档 
    2. 11.2 社区资源
    3. 11.3 商标
    4. 11.4 静电放电警告
    5. 11.5 Glossary
  12. 12机械、封装和可订购信息
  13. 重要声明
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DATA SHEET

DRV8833 双路 H 桥电机驱动器

本资源的原文使用英文撰写。 为方便起见,TI 提供了译文;由于翻译过程中可能使用了自动化工具,TI 不保证译文的准确性。 为确认准确性,请务必访问 ti.com 参考最新的英文版本(控制文档)。

1 特性

  • 双路 H 桥电流控制电机驱动器
    • 可以驱动两部直流电机或一部步进电机
    • 低金属氧化物半导体场效应晶体管 (MOSFET) 导通电阻:高侧 (HS) + 低侧 (LS) 360mΩ
  • 输出电流(VM = 5V,25°C 时)
    • 采用 PWP/RTY 封装:每条 H 桥的 RMS 电流为 1.5A,峰值电流为 2A
    • 采用 PW 封装:每条 H 桥的 RMS 电流为 500mA,峰值电流为 2A
  • 可以将输出并联,以实现
    • 3A RMS 电流、4A 峰值电流(PWP 和 RTY 封装)
    • 1A RMS 电流、4A 峰值电流(PW 封装)
  • 宽电源电压范围:
    2.7V 至 10.8V
  • PWM 绕组电流调节/电流限制
  • 耐热增强型表面贴装封装

2 应用

  • 电池供电式玩具
  • 服务点 (POS) 打印机
  • 视频安保摄像机
  • 办公自动化设备
  • 游戏机
  • 机器人

3 说明

DRV8833器件为玩具、打印机及其他机电一体化应用提供了一款双桥电机驱动器 解决方案。

该器件具有两个 H 桥驱动器,能够驱动两部直流刷式电机、一部双极步进电机、多个螺线管或其他感性负载。

每个 H 桥的输出驱动器模块由配置为 H 桥的 N 沟道功率 MOSFET 组成,用于驱动电机绕组。每个 H 桥均具备调节或限制绕组电流的电路。

该器件利用故障输出引脚实现内部关断功能,提供过流保护、短路保护、欠压锁定和过热保护。另外,还提供了一种低功耗休眠模式。

DRV8833 采用带有 PowerPAD™16 引脚超薄型四方扁平无引线 (WQFN) 封装(环保型:符合 RoHS 标准且不含锑/溴)。

器件信息(1)

器件型号 封装 封装尺寸(标称值)
DRV8833 TSSOP (16) 5.00mm x 4.40mm
HTSSOP (16) 5.00mm x 4.40mm
WQFN (16) 4.00mm x 4.00mm
  1. 要了解所有可用封装,请见数据表末尾的可订购产品附录。

简化电路原理图

DRV8833 sch_FAD_slvsar1.gif

4 修订历史记录

Changes from D Revision (March 2015) to E Revision

  • 已更新特性分项,以包括其他封装规范Go
  • Added note back to Pin Functions regarding the different I/O types Go
  • Corrected the device name and current regulation description in Overview Go
  • Corrected output current to 1.5-A RMS from 700-mA RMS Go

Changes from C Revision (January 2013) to D Revision

  • Added ESD 额定值表,特性 描述部分,器件功能模式,应用和实施部分,电源相关建议部分,布局部分,器件和文档支持部分以及机械、封装和可订购信息部分 Go

5 Pin Configuration and Functions

PWP Package
16-Pin HTSSOP
Top View
DRV8833 pwp_po_lvsar1.gif
PW Package
16-Pin TSSOP
Top View
DRV8833 pw_po_lvsar1.gif
RTY Package
16-Pin WQFN
Top View
DRV8833 rty_po1_lvsar1.gif

Pin Functions

PIN I/O(1) DESCRIPTION EXTERNAL COMPONENTS
OR CONNECTIONS
NAME WQFN HTSSOP,
TSSOP
POWER AND GROUND
GND 11
PPAD
13 — Device ground. HTSSOP package has PowerPAD. Both the GND pin and device PowerPAD must be connected to ground.
VINT 12 14 — Internal supply bypass Bypass to GND with 2.2-μF, 6.3-V capacitor.
VM 10 12 — Device power supply Connect to motor supply. A 10-µF (minimum) ceramic bypass capacitor to GND is recommended.
VCP 9 11 IO High-side gate drive voltage Connect a 0.01-μF, 16-V (minimum) X7R ceramic capacitor to VM.
CONTROL
AIN1 14 16 I Bridge A input 1 Logic input controls state of AOUT1. Internal pulldown.
AIN2 13 15 I Bridge A input 2 Logic input controls state of AOUT2. Internal pulldown.
BIN1 7 9 I Bridge B input 1 Logic input controls state of BOUT1. Internal pulldown.
BIN2 8 10 I Bridge B input 2 Logic input controls state of BOUT2. Internal pulldown.
nSLEEP 15 1 I Sleep mode input Logic high to enable device, logic low to enter low-power sleep mode and reset all internal logic. Internal pulldown.
STATUS
nFAULT 6 8 OD Fault output Logic low when in fault condition (overtemperature, overcurrent)
OUTPUT
AISEN 1 3 IO Bridge A ground / ISENSE Connect to current sense resistor for bridge A, or GND if current control not needed
BISEN 4 6 IO Bridge B ground / ISENSE Connect to current sense resistor for bridge B, or GND if current control not needed
AOUT1 16 2 O Bridge A output 1 Connect to motor winding A
AOUT2 2 4 O Bridge A output 2
BOUT1 5 7 O Bridge B output 1 Connect to motor winding B
BOUT2 3 5 O Bridge B output 2
(1) I = Input, O = Output, OZ = Tri-state output, OD = Open-drain output, IO = Input/output

 

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