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  • CC2564B to CC2564C Migration Guide

    • SWRU496B November   2018  – December 2021 CC2564C

       

  • CONTENTS
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  • CC2564B to CC2564C Migration Guide
  1.   Trademarks
  2. 1 Introduction
  3. 2 Hardware Migration
  4. 3 Software Migration
  5. 4 Low-Energy Secure Connections
  6. 5 Low Energy Secure Connections API Changes
    1. 5.1 Changes are in GAPAPI.h File
    2. 5.2 Function Changes
    3. 5.3 Structure Changes
    4. 5.4 Enumeration Changes
  7. 6 HCI API Changes
    1. 6.1 Function Changes
    2. 6.2 Structure Changes
    3. 6.3 Macro Changes
    4. 6.4 Enumeration Changes
  8. 7 iSPP API Changes
    1. 7.1 Function Changes
    2. 7.2 Structure Changes
  9. 8 GATT API Changes
    1. 8.1 Structure Changes
    2. 8.2 Macro Changes
    3. 8.3 Enumeration Changes
  10. 9 GAP API Changes
    1. 9.1 Function Changes
    2. 9.2 Structure Changes
    3. 9.3 Enumeration Changes
  11. 10L2CAP API changes
    1. 10.1 Function Changes
    2. 10.2 Structure Changes
    3. 10.3 Enumeration Changes
    4. 10.4 Macro Changes
  12. 11Revision History
  13. IMPORTANT NOTICE
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USER'S GUIDE

CC2564B to CC2564C Migration Guide

Trademarks

Bluetooth is a registered trademark of Bluetooth SIG, Inc.

All trademarks are the property of their respective owners.

1 Introduction

The CC2564C device is TI’s third generation of the CC2564 dual mode Bluetooth® and Bluetooth Low Energy single-chip solution compliant with Bluetooth 5.1. Bluetooth 5.1 support is implemented in TI Dual-Mode Bluetooth stack. For detailed features, performance, and functionality of the CC2564C device, see the respective documents:

  • Data sheet [1] CC2564C Dual-Mode Bluetooth® Control
  • User's guides [2]:
    • CC256xC QFN EM User’s Guide
    • CC256x QFN PCB Guidelines
  • Application notes [3] CC2564C Bluetooth® 4.1 and 4.2 Application Note

 
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