This document contains information for LM26420-Q1 (HTSSOP-20 and WQFN-16 packages) to aid in a functional safety system design. Information provided are:

• Functional safety failure in time (FIT) rates of the semiconductor component estimated by the application of industry reliability standards
• Component failure modes and their distribution (FMD) based on the primary function of the device
• Pin failure mode analysis (pin FMA)

Figure 1-1 and Figure 1-2 show the device functional block diagram for reference.

Figure 1-1 Functional Block Diagram HTSSOP-20 Package

Figure 1-2 Functional Block Diagram WQFN-16 Package

LM26420-Q1 was developed using a quality-managed development process, but was not developed in accordance with the IEC 61508 or ISO 26262 standards.

This section provides functional safety failure in time (FIT) rates for the HTSSOP-20 package of LM26420-Q1 based on an industry-wide used reliability standard:

• Table 2-1 provides FIT rates based on IEC TR 62380 / ISO 26262 part 11

The failure rate and mission profile information in Table 2-1 comes from the reliability data handbook IEC TR 62380 / ISO 26262 part 11:

• Mission profile: Automotive control from table 11
• Power dissipation: 750mW
• Climate type: World-wide table 8
• Package factor (lambda 3): Table 17b
• Substrate material: FR4
• EOS FIT rate assumed: 0 FIT