The TPS7B4250-Q1 device is a monolithic, integrated low-dropout voltage tracker. The device is available in a SOT-23 package. The TPS7B4250-Q1 device is designed to supply off-board sensors in an automotive environment. The IC has integrated protection for overload, over temperature, reverse polarity, and output short-circuit to the battery and ground.
A reference voltage applied at the adjust-input pin, ADJ, regulates supply voltages up to VIN = 45 V with high accuracy and loads up to 50 mA.
By setting the adjust/enable input pin, ADJ/EN, to low, the TPS7B4250-Q1 device switches to standby mode which reduces the quiescent current to the minimum value.
| PART NUMBER | PACKAGE | BODY SIZE (NOM) | 
|---|---|---|
| TPS7B4250-Q1 | SOT-23 (5) | 2.90 mm × 1.60 mm | 
Changes from B Revision (July 2015) to C Revision
Changes from A Revision (November 2013) to B Revision
Changes from * Revision (October 2013) to A Revision
| PIN | TYPE | DESCRIPTION | |
|---|---|---|---|
| NAME | NO. | ||
| ADJ/EN | 1 | I | This pin connects to the reference voltage. A low signal disables the IC and a high signal enables the device. Connected the voltage reference directly or with a voltage divider for lower output voltages. To compensate for line influences, TI recommends to place a capacitor close to the IC pins. | 
| GND | 2 | G | Internally connected to pin 5 | 
| GND | 5 | G | Internally connected to pin 2 | 
| VIN | 3 | I | This pin is the device supply. To compensate for line influences, TI recommends to place a capacitor close to the IC pins. | 
| VOUT | 4 | O | VOUT is an external capacitor that is required between VOUT and GND with respect to the capacitance and ESR requirements given in the Recommended Operating Conditions. | 
| MIN | MAX | UNIT | |||
|---|---|---|---|---|---|
| Input voltage, unregulated input, VIN(2)(3) | –20 | 45 | V | ||
| Output voltage, regulated output, VOUT | –1 | 22 | V | ||
| Adjust input and enable input voltage, ADJ/EN(2)(3) | –0.3 | 22 | V | ||
| ADJ Voltage minus input voltage (ADJ–VIN), VIN > 0 V | 7 | V | |||
| Operating junction temperature, TJ | –40 | 150 | °C | ||
| Storage temperature, Tstg | –65 | 150 | °C | ||
| VALUE | UNIT | |||
|---|---|---|---|---|
| V(ESD) | Electrostatic discharge | Human-body model (HBM), per AEC Q100-002(1) | ±4000 | V | 
| Charged-device model (CDM), per AEC Q100-011 | ±1000 | |||
| MIN | MAX | UNIT | ||
|---|---|---|---|---|
| VIN | Unregulated input | 4 | 40 | V | 
| VOUT | regulated output | 1.5 | 18 | V | 
| ADJ/EN | Adjust input and enable input voltage | 1.5 | 18 | V | 
| ADJ–VIN | ADJ voltage minus input voltage | 5 | V | |
| COUT | Output capacitor requirements(1) | 1 | 50 | µF | 
| ESRCOUT | Output ESR requirements | 0.001 | 20 | Ω | 
| TJ | Operating junction temperature | –40 | 150 | °C | 
| THERMAL METRIC(2)(1) | TPS7B4250-Q1 | UNIT | |
|---|---|---|---|
| DBV (SOT-23) | |||
| 5 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 171.7 | °C/W | 
| RθJC(top) | Junction-to-case (top) thermal resistance | 81.1 | °C/W | 
| RθJB | Junction-to-board thermal resistance | 31.7 | °C/W | 
| ψJT | Junction-to-top characterization parameter | 4.5 | °C/W | 
| ψJB | Junction-to-board characterization parameter | 31.2 | °C/W | 
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | °C/W | 
| PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | |
|---|---|---|---|---|---|---|
| VUVLO | VIN undervoltage detection | Ramp up VI until the output turns on, VADJ = 1.5 V | 3.65 | V | ||
| Ramp down VI until the output turns off, VADJ = 1.5 V | 3 | |||||
| ΔVO | Output-voltage tracking accuracy | IO = 100 µA to 1 mA, VI = 4 V to 40 V, 1.5 V < VADJ < VI – 0.3 V | –4 | 4 | mV | |
| IO = 1 mA to 50 mA, VI = 4 V to 40 V, 1.5 V < VADJ < VI – 1.5 V | –5 | 5 | ||||
| ΔVO(ΔIL) | Load regulation steady-state | IO = 1 mA to 30 mA | 4 | mV | ||
| ΔVO(ΔVI) | Line regulation steady-state | IO = 10 mA, VI = 6 V to 40 V | 3 | mV | ||
| PSRR | Power-supply ripple rejection | Frequency = 100 Hz, Vrip = 0.5 VPP, IO = 5 mA, CO = 2.2 µF | 60 | dB | ||
| Vdropout | Dropout voltage, Vdropout = VI – VQ | IO = 10 mA, VI ≥ 4 V(1) | 150 | 265 | mV | |
| IO = 50 mA, VI ≥ 4 V(1) | 550 | 1000 | ||||
| IL | Output-current limitation | VO short to GND | 100 | 500 | mA | |
| IR | Reverse current at VIN | VI = 0 V, VO = 20 V, VADJ = 5 V | –5 | 0 | µA | |
| IRN1 | Reverse current at negative input voltage | VI = –20 V, VO = 0 V, VADJ = 5 V | –5 | 0 | µA | |
| IRN2 | VI = –20 V, VO = 20 V, VADJ = 5 V | –5 | 0 | |||
| TSD | Thermal shutdown temperature | TJ increasing because of power dissipation generated by the IC | 175 | °C | ||
| IQ | Current consumption | VADJ < 0.8 V, TA ≤ 85°C(2) | 7.5 | 15 | µA | |
| VADJ < 0.8 V, TA ≤ 125°C | 20 | |||||
| IO = 0.5 mA, VADJ = 5 V | 40 | 90 | ||||
| IO = 30 mA, VADJ = 5 V | 150 | 350 | ||||
| IADJ | Adjust-input and enable-input current | VADJ = 5 V | 1 | µA | ||
| VADJ,low | Adjust and enable low signal valid | VO = 0 V | 0.8 | V | ||
| VADJ,high | Adjust and enable high signal valid | |VO – VADJ| < 5 mV | 1.5 | 18 | V | |
 
 | VI = VADJ = 4 V | IO = 10 mA | |
 
 | VI = 13.5 V | VADJ = 5 V | |
 
 | VI = VADJ = 4 V | ||
 
 | VI = 13.5 V | VADJ = 5 V | IO = 1 mA, 50 mA | 
