TI qualification testing is a risk mitigation process that is engineered to assure device longevity in customer applications. Wafer fabrication process and package level reliability are evaluated in a variety of ways that may include accelerated environmental test conditions with subsequent derating to actual use conditions. Manufacturability of the device is evaluated to verify a robust assembly flow and assure continuity of supply to customers. TI Enhanced Products are qualified with industry standard test methodologies performed to the intent of Joint Electron Devices Engineering Council (JEDEC) standards and procedures. Texas Instruments Enhanced Products meet GEIA-STD-0002-1 Aerospace Qualified Electronic Components.

ADC3683-SEP is a radiation hardened device in a plastic package which allows this device to be used in space applications. The device was verified immune to 43MeV × cm² / mg at 125°C for single event latch-up (SEL). Each fabrication lot was tested according to MIL-STD-883 for Radiation Lot Acceptance Tested (RLAT) up to 30 krad(Si) and each assembly and test lot follows the process flow shown in Figure 2-1. To verify the quality of ADC3683-SEP, the device is qualified with Space EP requirements. See Section 3 for further details.

The following is the device qualification summary.

Qualification by Similarity (Qualification Family)

A new device can be qualified either by performing full scale quality and reliability tests on the actual device or using previously qualified devices through Qualification by Similarity (QBS) rules. By establishing similarity between the new device and those qualified previously, repetitive tests are eliminated, allowing for timely production release. When adopting QBS methodology, the emphasis is on qualifying the differences between a previously qualified product and the new product under consideration.

The QBS rules for a technology, product, test parameters, or package shall define which attributes are required to remain fixed for the QBS rules to apply. The attributes which are expected and allowed to vary is reviewed and a QBS plan is developed, based on the reliability impact assessment above, specifying what subset of the full complement of environmental stresses is required to evaluate the reliability impact of those variations. Each new device is reviewed for conformance to the QBS rule sets applicable to that device. See JEDEC JESD47 for more information.

1. *Precondition performed per JEDEC Std. 22, Method A112/A113.

Outgassing test was performed on Die attach and Mold compound used for the ADC3683-SEP. A total mass loss (TML) of 1.00% and collected volatile condensable material (CVCM) of 0.1% were used as screening levels for rejection of spacecraft materials. The outgas test was performed in a vacuum environment of less than 5 × 10^–5 Torr according to ASTM E 595, for a duration of 24 hours, at 125°C. The TML and CVCM were measured after the test.